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专利名称：Method for manufacturing an electric or
electronic device with power orcommunication interface
发明人：DOSSETTO, LUCILE,OTTOBON, STÉPHANE申请号：EP12306500.5申请日：20121130公开号：EP2738714A1公开日：20140604
专利附图：
摘要：The method involves providing or producing a set of electrical devices (2A) orelectronic devices on a leadframe (1) that is made of rupture-adapted fragile material i.e.
fibers, where a thickness of the leadframe is 50-200 micrometer. A preliminary cut (5) isformed in the leadframe about the electrical or electronic devices, where the preliminarycut enables manual separation of the electrical or electronic devices from the leadframe.A set of electronic chips is connected to a set of communication interfaces (10). A case isformed to cover the electronic chips. An independent claim is also included for aleadframe coil.
申请人：GEMALTO SA
地址：6 Rue de la Verrerie 92190 Meudon FR
国籍：FR
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