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专利名称:Packaging structure of mini SD memory card发明人:Chin-Chun Liu,Shih-Tung Liu申请号:US11272060申请日:20051114公开号:US07345848B2公开日:20080318
专利附图:
摘要:The present invention provides an improved packaging structure of a memorycard, such as mini SD memory card. The packaging structure comprises a substrate havinga plurality of integrated circuit devices and passive devices located therein, and a metalcover having an insulating layer formed on a top portion of the metal cover. A plurality of
protruding plates bending downward are formed around a circumferential area of themetal cover, and a roll-shaped fixing part is formed at a bottom portion of a particularprotruding plate. The roll-shaped fixing part and the protruding plates are utilized toengage the frame with the metal cover to form a sealed structure so that the framecovers all the protruding plates and the roller-shaped fixing part of the metal cover. Theintegrated circuit devices and the passive devices are located within the space of theframe to form a mini SD memory card package.
申请人:Chin-Chun Liu,Shih-Tung Liu
地址:Pingjhen TW,Fuji Village TW
国籍:TW,TW
代理机构:Dykema Gossett PLLC
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