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Process for fabricating semiconductor integrated c

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专利名称:Process for fabricating semiconductor

integrated circuit device, and exposingsystem and mask inspecting method to beused in the process

发明人:Yoshihiko Okamoto,Noboru Moriuchi申请号:US08/483983申请日:19950607公开号:US05667941A公开日:19970916

摘要:Herein disclosed is an exposure technology for a semiconductor integratedcircuit device which has a pattern as fine as that of an exposure wavelength. Thetechnology contemplates to improve the resolution characteristics of the pattern bymaking use of the mutual interference of exposure luminous fluxes.

申请人:HITACHI, LTD.

代理机构:Fay, Sharpe, Beall, Fagan, Minnich & McKee

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