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CONDUCTIVE COMPOSITION

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专利内容由知识产权出版社提供

专利名称:CONDUCTIVE COMPOSITION发明人:ZHANG, Yong W,WANG, William Z,SHI,

Susan,FOLKENROTH, Jason J

申请号:EP12886806.4申请日:20121015公开号:EP29071A1公开日:20150819

摘要:Disclosed is a conductive composition useful for the preparation of electricallyconductive structures on a substrate comprising a plurality of metal particles, a pluralityof glass particles and a vehicle comprising at least one cellulose derivative and at leastone solid organopolysiloxane resin dissolved in a mutual organic solvent. The solidorganopolysiloxane resin acts as adhesion promoter and assists in stably dispersing themetal and glass particles to avoid an agglomeration of such particles without degradingthe rheological properties. From such conductive compositions uniform well adherentelectrically conductive structures essentially free from defects in the form of cracks,bubbles or coarse particulates can be prepared on dielectric or semiconductorsubstrates such as silicon wafers in an efficient and cost-saving manner e.g. by screenprinting, drying and sintering while inducing only low warping of the substrate. Thesecharacteristics render said conductive compositions particularly useful for the fabricationof electrodes of a semiconductor solar cell helping to increase the cell conversionefficiency.

申请人:Dow Global Technologies LLC

地址:2040 Dow Center Midland, MI 48674 US

国籍:US

代理机构:f & e patent

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