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Method of inspecting electric characteristics of w

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专利名称:Method of inspecting electric characteristics

of wafers and apparatus therefor

发明人:Masaaki Iwamatsu,Ryuichi

Takebuchi,Yoshihito Marumo,WataruKarasawa

申请号:US07/420525申请日:191012公开号:US05124931A公开日:19920623

摘要:In a method of inspecting the electric characteristics of wafers, detecting forsecond and subsequent alignment operations of probe cards is automatically executed.In an apparatus for inspecting the electric characteristics of wafer, different types ofwafers can be continuously inspected using the same probe card on the basis ofprestored alignment data of each type of wafers.

申请人:TOKYO ELECTRON LIMITED

代理机构:Oblon, Spivak, McClelland, Maier & Neustadt

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