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专利名称:Method of inspecting electric characteristics
of wafers and apparatus therefor
发明人:Masaaki Iwamatsu,Ryuichi
Takebuchi,Yoshihito Marumo,WataruKarasawa
申请号:US07/420525申请日:191012公开号:US05124931A公开日:19920623
摘要:In a method of inspecting the electric characteristics of wafers, detecting forsecond and subsequent alignment operations of probe cards is automatically executed.In an apparatus for inspecting the electric characteristics of wafer, different types ofwafers can be continuously inspected using the same probe card on the basis ofprestored alignment data of each type of wafers.
申请人:TOKYO ELECTRON LIMITED
代理机构:Oblon, Spivak, McClelland, Maier & Neustadt
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